Kepro FR-4 1/OZ 2/Sides 17″x10″x.062″ Photosensitized Laminate S2-710G
The Kepro FR-4 S2-710G is a high-quality, photosensitized laminate designed for precision in printed circuit board (PCB) fabrication. Measuring 17 inches by 10 inches with a thickness of 0.062 inches, this laminate features a double-sided 1-ounce copper cladding, making it ideal for a wide range of electronic applications.
Key Features
- Material Composition: Constructed from FR-4, a glass-reinforced epoxy laminate known for its excellent mechanical strength and electrical insulation properties.
- Photosensitized Surface: Pre-coated with a photosensitive layer, facilitating efficient and accurate PCB patterning through photolithography processes.
- Double-Sided Copper Cladding: Each side is clad with 1-ounce copper (approximately 35 micrometers thick), providing robust conductivity and durability for complex circuit designs.
- Standard Dimensions: The 17″x10″ size offers ample space for various PCB layouts, while the 0.062-inch thickness ensures structural integrity and compatibility with standard PCB manufacturing processes.
Applications
The Kepro FR-4 S2-710G laminate is suitable for a variety of applications, including:
- Prototyping and development of electronic circuits.
- Manufacturing of multilayer PCBs for consumer electronics.
- Production of high-frequency and RF circuit boards.
- Educational and research projects requiring reliable PCB materials.
Benefits
- Enhanced Precision: The photosensitized coating allows for detailed and accurate circuit patterns, reducing the likelihood of errors during the etching process.
- Durability: FR-4 material provides high mechanical strength and resistance to moisture, ensuring longevity and reliability of the finished PCBs.
- Versatility: Compatible with various etching and processing techniques, making it suitable for both professional manufacturing and DIY electronics projects.
In summary, the Kepro FR-4 S2-710G photosensitized laminate offers a reliable and efficient solution for PCB fabrication, combining high-quality materials with user-friendly features to meet the demands of modern electronic design and manufacturing.

















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