The Kepro 52-36G Photosensitized FR-4 Copper Clad Laminate is a high-quality material designed for precision printed circuit board (PCB) fabrication.
Key Features
- Photosensitized Surface: Pre-coated with a light-sensitive layer, facilitating direct imaging processes and eliminating the need for manual application of photoresist.
- FR-4 Substrate: Constructed from flame-retardant woven glass cloth impregnated with epoxy resin, offering excellent mechanical strength and electrical insulation.
- Copper Cladding: Laminated with high-quality copper foil, ensuring superior conductivity and reliable signal transmission.
- Dimensional Stability: Maintains consistent dimensions under varying environmental conditions, crucial for high-precision PCB designs.
- Thermal Resistance: Capable of withstanding elevated temperatures, making it suitable for lead-free soldering processes.
Applications
Ideal for prototyping and small-scale production runs, the Kepro 52-36G is suitable for a wide range of electronic applications, including consumer electronics, industrial equipment, and communication devices.
Specifications
- Thickness: Available in various thicknesses to meet specific design requirements.
- Copper Weight: Options include standard 1 oz (35 μm) and 0.5 oz (17 μm) copper cladding.
- Sheet Size: Standard dimensions are 9″ x 12″ (229 mm x 305 mm), with custom sizes available upon request.
The Kepro 52-36G Photosensitized FR-4 Copper Clad Laminate combines ease of use with high performance, making it an excellent choice for PCB manufacturers, design engineers, hobbyists, and students seeking reliable and efficient PCB materials.
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